Prof. Yimao Cai from Peking University Joins GMIF2024 to Explore the Evolution of In-Memory Computing Technologies in the AI Era
9月27日，第三屆GMIF2024創(chuàng)新峰會(huì)將在深圳灣萬麗酒店舉辦，本屆峰會(huì)以“AI驅(qū)動(dòng)，存儲(chǔ)復(fù)蘇”為主題，將圍繞存儲(chǔ)器市場(chǎng)復(fù)蘇與AI新興應(yīng)用市場(chǎng)帶動(dòng)下的產(chǎn)業(yè)格局與趨勢(shì)，分享前沿技術(shù)與最新產(chǎn)品，探討產(chǎn)業(yè)鏈上下游如何協(xié)同創(chuàng)新，構(gòu)建合作共贏的產(chǎn)業(yè)生態(tài)。
On September 27, the Third GMIF2024 Innovation Summit will be held at the Renaissance Shenzhen Bay Hotel. The summit, themed "AI Leads Memory's New Momentum", centers around the recovery of the memory market and the evolving industry landscape and trends driven by emerging AI applications.
The gathering will see enterprises come together to showcase the state-of-the-art technologies and the latest products, discuss how to collaborate and innovate in the upstream and downstream of the industry chain, and explore ways to build a cooperative and mutually beneficial industrial ecosystem.
在人工智能迅速發(fā)展的背景下，存儲(chǔ)器和存內(nèi)計(jì)算技術(shù)的重要性日益凸顯。隨著數(shù)據(jù)量的激增及AI算法復(fù)雜度的提升，傳統(tǒng)系統(tǒng)架構(gòu)中的數(shù)據(jù)搬運(yùn)慢、能耗高等問題已成為計(jì)算性能瓶頸。存內(nèi)計(jì)算技術(shù)，即一種以存儲(chǔ)為中心的計(jì)算架構(gòu)，通過將存儲(chǔ)與計(jì)算功能融合，避免了數(shù)據(jù)在不同存儲(chǔ)層級(jí)間的頻繁移動(dòng)，不僅顯著減少了數(shù)據(jù)搬運(yùn)的延遲和能耗，還極大提升了計(jì)算效率，降低了運(yùn)營成本，推動(dòng)高性能計(jì)算、邊緣計(jì)算、機(jī)器學(xué)習(xí)及多模態(tài)大模型等領(lǐng)域的快速發(fā)展。隨著新型存儲(chǔ)介質(zhì)（如相變存儲(chǔ)器PCM、磁阻隨機(jī)存取存儲(chǔ)器MRAM等）的不斷進(jìn)步，存內(nèi)計(jì)算技術(shù)將進(jìn)一步促進(jìn)計(jì)算與存儲(chǔ)的一體化，助力更智能、更高效、更優(yōu)TCO的數(shù)據(jù)中心建設(shè)，為智能應(yīng)用奠定堅(jiān)實(shí)的技術(shù)基礎(chǔ)。
Amid the rapid development of artificial intelligence, the significance of memory and in-memory computing technologies is becoming increasingly prominent. The surge in data volumes coupled with the rising complexity of AI algorithms has exposed inefficiencies in traditional system architectures, where sluggish data transfers and excessive energy consumption have become major performance bottlenecks. In-memory computing, a storage-centric architecture, integrates storage and computation functions for the purpose of minimizing the frequent movement of data across different memory layers. This technology not only helps to achieve a marked reduction in data transfer latency and energy consumption but also significantly enhance computational efficiency and lower operational costs, aiming to accelerate advancements in high-performance computing, edge computing, machine learning, and multi-modal large models. With ongoing advancements in emerging memory media, such as phase-change memory (PCM) and magnetoresistive random-access memory (MRAM), in-memory computing is poised to further promote the integration of computation and storage and contribute to the development of smarter, more efficient data centers with optimized total cost of ownership (TCO), providing a solid technological foundation for intelligent applications.
作為集成電路領(lǐng)域的權(quán)威專家，北京大學(xué)集成電路學(xué)院院長蔡一茂教授將受邀出席GMIF2024，并發(fā)表題為《AI時(shí)代的存儲(chǔ)器與存內(nèi)計(jì)算技術(shù)發(fā)展 》的演講，探討存儲(chǔ)器和存內(nèi)計(jì)算技術(shù)在AI時(shí)代的演變和創(chuàng)新，特別是在應(yīng)對(duì)新興AI應(yīng)用中大規(guī)模數(shù)據(jù)處理和高速計(jì)算需求方面的潛力與挑戰(zhàn)，展望未來存儲(chǔ)器與存內(nèi)計(jì)算技術(shù)的發(fā)展趨勢(shì)和產(chǎn)業(yè)應(yīng)用潛力。
Prof. Yimao Cai, a distinguished authority in integrated circuits and Dean of the School of Integrated Circuits at Peking University, will be invited to attend GMIF2024 as a keynote speaker. The speech, titled “The Evolution of Memory and In-Memory Computing Technologies in the AI Era”, will investigate the evolution and innovations in memory and in-memory computing technologies within the AI landscape, with a particular focus on their potential and challenges for large-scale data processing and high-speed computing. Prof. Cai will also provide a forward-looking perspective on the development trends and application potential in memory and in-memory computing technologies.
蔡一茂 北京大學(xué)集成電路學(xué)院 院長
Yimao Cai Dean, School of Integrated Circuits, Peking University
“蔡一茂教授，現(xiàn)任北京大學(xué)集成電路學(xué)院院長，博雅特聘教授，國家杰出青年和教育部長江青年學(xué)者。蔡教授長期從事先進(jìn)半導(dǎo)體器件與集成、存儲(chǔ)器及感存算芯片關(guān)鍵技術(shù)研究，并取得了多項(xiàng)具有國際影響力的創(chuàng)新性學(xué)術(shù)成果和技術(shù)應(yīng)用成果，并主持多項(xiàng)國家級(jí)項(xiàng)目，為我國新型存儲(chǔ)技術(shù)創(chuàng)新與產(chǎn)業(yè)發(fā)展做出 重要貢獻(xiàn)?！?/p>
“Prof. Yimao Cai currently serves as the Dean of the School of Integrated Circuits at Peking University, and he also holds the titles of Boya Distinguished Professor, National Outstanding Young Scientist, and Yangtze River Scholar of the Ministry of Education. Prof. Cai has long been engaged in research on advanced semiconductor devices and integration, memory, and sensing-computing integrated chip key technologies. Prof. Cai has achieved numerous innovative academic and technical application with international influence and has led several national-level projects, making significant contributions to the innovation and development of new storage technologies in China.”
關(guān)于 北京大學(xué)集成電路學(xué)院
About School of Integrated Circuits, Peking University
北京大學(xué)集成電路學(xué)院，源自黃昆先生在1950年代創(chuàng)立的“五校聯(lián)合半導(dǎo)體專門化”，是中國半導(dǎo)體科學(xué)技術(shù)研究和人才培養(yǎng)的先驅(qū)。學(xué)院成立于2021年，擁有多個(gè)國家級(jí)、省部級(jí)創(chuàng)新研究平臺(tái)及國際合作平臺(tái)，并擁有國際一流水平的前沿研究環(huán)境。獲得多個(gè)國家級(jí)創(chuàng)新團(tuán)隊(duì)稱號(hào)，取得了一批具有國際影響力的成果。學(xué)院圍繞學(xué)術(shù)前沿和產(chǎn)業(yè)需求，成為集成電路科技創(chuàng)新與人才培養(yǎng)的高地，是北大新工科建設(shè)的一面旗幟，為培養(yǎng)創(chuàng)新人才、科技創(chuàng)新和服務(wù)國家重大戰(zhàn)略做出重大貢獻(xiàn)。
The School of Integrated Circuits at Peking University traces its origins to the “Five-School Joint Semiconductor Specialization”, founded by Mr. Huang Kun in the 1950s. It is a pioneer in semiconductor science and technology research and talent cultivation in China. Established in 2021, the school boasts multiple national and provincial innovation research platforms, as well as international cooperation platforms, providing a world-class cutting-edge research environment. The school has been recognized with several national innovation team titles and has achieved a number of internationally influential outcomes. Focusing on academic frontiers and industry needs, the school has become a hub for technological innovation and talent cultivation in integrated circuits. It is a flagship of Peking University’s new engineering disciplines, making significant contributions to cultivating innovative talents, advancing technological innovation, and serving the country’s major strategic needs.
關(guān)于 GMIF
About GMIF
GMIF為深圳市存儲(chǔ)器行業(yè)協(xié)會(huì)（Shenzhen Memory Industry Association，SMIA）最重要的年度活動(dòng)，論壇旨在搭建一個(gè)全球存儲(chǔ)器行業(yè)國際化、專業(yè)化的交流平臺(tái)，共同探討新技術(shù)、新應(yīng)用、新合作、新機(jī)遇。第三屆GMIF2024創(chuàng)新峰會(huì)將于2024年9月27日在深圳灣萬麗酒店舉辦，峰會(huì)以“AI驅(qū)動(dòng)，存儲(chǔ)復(fù)蘇”為主題，致力于為存儲(chǔ)產(chǎn)業(yè)上下游廠商提供溝通交流的機(jī)會(huì)，加強(qiáng)產(chǎn)業(yè)伙伴間的協(xié)同與互補(bǔ)發(fā)展，全方位助力參會(huì)企業(yè)擴(kuò)大產(chǎn)品和品牌傳播力度，賦能全球存儲(chǔ)器產(chǎn)業(yè)鏈生態(tài)共贏！
GMIF(Global Memory Innovation Forum) is the most important annual event of Shenzhen Memory Industry Association (SMIA). The forum aims to build a globally-focused, professional platform for the storage industry to collectively explore new technologies, applications, collaborations, and emerging opportunities. The Third GMIF2024 Innovation Summit is scheduled to be held on September 27, 2024 at Renaissance Shenzhen Bay Hotel. Under the theme of "AI Leads Memory's New Momentum", the summit aims to foster communication and interaction among both upstream and downstream enterprises in the storage industry. By promoting collaboration and complementary growth among industry partners, the GMIF seeks to help participating companies expand their product and brand reach and contribute to a thriving, win-win ecosystem in the global storage sector.
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